文献
J-GLOBAL ID:201702292283257162
整理番号:17A0375119
電子パッケージにおける完全Cu_3Sn継手の形成に対するはんだ付けプロセスと界面微細構造発展の研究【Powered by NICT】
Investigation of soldering process and interfacial microstructure evolution for the formation of full Cu3Sn joints in electronic packaging
著者 (4件):
Yao Peng
(College of Materials Science and Engineering, Beijing University of Technology, No. 100 Ping Le Yuan, Chaoyang District, Beijing 100124, PR China)
,
Li Xiaoyan
(College of Materials Science and Engineering, Beijing University of Technology, No. 100 Ping Le Yuan, Chaoyang District, Beijing 100124, PR China)
,
Liang Xiaobo
(College of Materials Science and Engineering, Beijing University of Technology, No. 100 Ping Le Yuan, Chaoyang District, Beijing 100124, PR China)
,
Yu Bo
(College of Materials Science and Engineering, Beijing University of Technology, No. 100 Ping Le Yuan, Chaoyang District, Beijing 100124, PR China)
資料名:
Materials Science in Semiconductor Processing
(Materials Science in Semiconductor Processing)
巻:
58
ページ:
39-50
発行年:
2017年
JST資料番号:
W1055A
ISSN:
1369-8001
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)