文献
J-GLOBAL ID:201802214878106978
整理番号:18A1591560
Sn-Ag-Cu/Au/Pd(xP)/Ni(P)反応系の界面微細構造と機械的信頼性:P含有量効果【JST・京大機械翻訳】
Interfacial microstructure and mechanical reliability of the Sn-Ag-Cu/Au/Pd(xP)/Ni(P) reactive system: P content effects
著者 (6件):
Wu Ying-Syuan
(Department of Chemical Engineering & Materials Science, Yuan Ze University, Chungli Dist., Taoyuan City 320, Taiwan, ROC)
,
Lee Pei-Tzu
(Department of Chemical Engineering & Materials Science, Yuan Ze University, Chungli Dist., Taoyuan City 320, Taiwan, ROC)
,
Huang Yu-Hsuan
(Department of Chemical Engineering & Materials Science, Yuan Ze University, Chungli Dist., Taoyuan City 320, Taiwan, ROC)
,
Kuo Tsai-Tung
(Department of Chemical Engineering & Materials Science, Yuan Ze University, Chungli Dist., Taoyuan City 320, Taiwan, ROC)
,
Kuo Tsai-Tung
(Taiwan Uyemura Limited Company, Dayuan Dist., Taoyuan City 337, Taiwan, ROC)
,
Ho Cheng-En
(Department of Chemical Engineering & Materials Science, Yuan Ze University, Chungli Dist., Taoyuan City 320, Taiwan, ROC)
資料名:
Surface & Coatings Technology
(Surface & Coatings Technology)
巻:
350
ページ:
874-879
発行年:
2018年
JST資料番号:
D0205C
ISSN:
0257-8972
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)