文献
J-GLOBAL ID:201802226848325123
整理番号:18A0189810
バインダジェット技術によるチョーク粉末NRD端子接合の付加製造【Powered by NICT】
Additive manufacturing of a chalk powder NRD 3-port junction via binder jetting technology
著者 (8件):
Massoni E.
(Dept. of Electrical, Computer and Biomedical Engineering, University of Pavia, Pavia, Italy)
,
Espin-Lopez P. F.
(Dept. of Electrical, Computer and Biomedical Engineering, University of Pavia, Pavia, Italy)
,
Pasian M.
(Dept. of Electrical, Computer and Biomedical Engineering, University of Pavia, Pavia, Italy)
,
Bozzi M.
(Dept. of Electrical, Computer and Biomedical Engineering, University of Pavia, Pavia, Italy)
,
Perregrini L.
(Dept. of Electrical, Computer and Biomedical Engineering, University of Pavia, Pavia, Italy)
,
Marconi S.
(Dept. of Civil Engineering and Architecture, University of Pavia, Pavia, Italy)
,
Alaimo G.
(Dept. of Civil Engineering and Architecture, University of Pavia, Pavia, Italy)
,
Auricchio E.
(Dept. of Civil Engineering and Architecture, University of Pavia, Pavia, Italy)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2017
号:
IMWS-AMP
ページ:
1-3
発行年:
2017年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)