文献
J-GLOBAL ID:201802229494387136
整理番号:18A1900302
Si系材料の低温直接接合のためのVUV/O_3活性化ボンダ【JST・京大機械翻訳】
VUV/O3 activated bonder for low-temperature direct bonding of Si-based materials
著者 (6件):
Xu Jikai
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, China)
,
Wang Chenxi
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, China)
,
Qi Xiaoyun
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, China)
,
Wu Bin
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, China)
,
Zhou Shicheng
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, China)
,
Tian Yanhong
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, China)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2018
号:
ICEPT
ページ:
1448-1452
発行年:
2018年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)