文献
J-GLOBAL ID:201802230794744483
整理番号:18A1770930
深部神経回路網を用いた細粒創傷組織分析【JST・京大機械翻訳】
Fine-Grained Wound Tissue Analysis Using Deep Neural Network
著者 (7件):
Nejati H.
(Singapore University of Technology and Design (SUTD), 487372, Singapore)
,
Ghazijahani H. A.
(Singapore University of Technology and Design (SUTD), 487372, Singapore)
,
Abdollahzadeh M.
(Singapore University of Technology and Design (SUTD), 487372, Singapore)
,
Malekzadeh T.
(Singapore University of Technology and Design (SUTD), 487372, Singapore)
,
Cheung N.-M.
(Singapore University of Technology and Design (SUTD), 487372, Singapore)
,
Lee K.-H.
(Singapore University of Technology and Design (SUTD), 487372, Singapore)
,
Low L.-L.
(Singapore University of Technology and Design (SUTD), 487372, Singapore)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2018
号:
ICASSP
ページ:
1010-1014
発行年:
2018年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)