文献
J-GLOBAL ID:201802231519455242
整理番号:18A1900055
電子パッケージ用の反応特性と高熱伝導率を有する両面接着テープの調製と特性化【JST・京大機械翻訳】
Preparation and characterization of the double-side adhesive tape with reactive properties and high thermal conductivity for electronic package
著者 (5件):
Chang Hao
(Guangdong Provincial Key Laboratory of Materials for High Density Electronic Packaging, Shenzhen Institutes of Advanced Technology, Shenzhen, China)
,
Zhang Baotan
(Guangdong Provincial Key Laboratory of Materials for High Density Electronic Packaging, Shenzhen Institutes of Advanced Technology, Shenzhen, China)
,
Zhu Pengli
(Guangdong Provincial Key Laboratory of Materials for High Density Electronic Packaging, Shenzhen Institutes of Advanced Technology, Shenzhen, China)
,
Sun Rong
(Guangdong Provincial Key Laboratory of Materials for High Density Electronic Packaging, Shenzhen Institutes of Advanced Technology, Shenzhen, China)
,
Wong Chingping
(Wong Department of Electronic Engineering, The Chinese University of Hong Kong, Hong Kong, China)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2018
号:
ICEPT
ページ:
319-323
発行年:
2018年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)