文献
J-GLOBAL ID:201802233075621946
整理番号:18A1380664
自己集合単分子層を用いたCu/Cu結合のキャラクタリゼーション【JST・京大機械翻訳】
Characterisation of Cu/Cu bonding using self-assembled monolayer
著者 (7件):
Lykova Maria
(Institute of Electronic Packaging Technology, Technische Universitaet Dresden, Dresden, Germany)
,
Panchenko Iuliana
(Institute of Electronic Packaging Technology, Technische Universitaet Dresden, Dresden, Germany, and Fraunhofer Institute for Reliability and Microintegration, Dresden Branch of the Institute, Dresden, Germany)
,
Kuenzelmann Ulrich
(Institute of Semiconductors and Microsystems, Technische Universitat Dresden, Dresden, Germany)
,
Reif Johanna
(Institute of Semiconductors and Microsystems, Technische Universitat Dresden, Dresden, Germany)
,
Geidel Marion
(Institute of Semiconductors and Microsystems, Technische Universitat Dresden, Dresden, Germany)
,
Wolf M. Juergen
(Dresden Branch of the Institute, Fraunhofer Institute for Reliability and Microintegration, Dresden, Germany)
,
Lang Klaus-Dieter
(Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany)
資料名:
Soldering & Surface Mount Technology
(Soldering & Surface Mount Technology)
巻:
30
号:
2
ページ:
106-111
発行年:
2018年
JST資料番号:
H0953A
ISSN:
0954-0911
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)