文献
J-GLOBAL ID:201802239774146579
整理番号:18A1680690
集積プラズモン素子のための平滑なAu薄膜を用いた室温ウエハボンディング【JST・京大機械翻訳】
Room-Temperature Wafer Bonding Using Smooth Au Thin Films for Integrated Plasmonic Devices
著者 (7件):
Yamamoto Michitaka
(National Institute of Advanced Industrial Science and Technology (AIST), 1-2-1 Namiki, Tsukuba, Ibaraki, 305-8564, Japan)
,
Matsumae Takashi
(National Institute of Advanced Industrial Science and Technology (AIST), 1-2-1 Namiki, Tsukuba, Ibaraki, 305-8564, Japan)
,
Kurashima Yuichi
(National Institute of Advanced Industrial Science and Technology (AIST), 1-2-1 Namiki, Tsukuba, Ibaraki, 305-8564, Japan)
,
Takagi Hideki
(National Institute of Advanced Industrial Science and Technology (AIST), 1-2-1 Namiki, Tsukuba, Ibaraki, 305-8564, Japan)
,
Suga Tadatomo
(The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo, 113-8656, Japan)
,
Itoh Toshihiro
(National Institute of Advanced Industrial Science and Technology (AIST), 1-2-1 Namiki, Tsukuba, Ibaraki, 305-8564, Japan)
,
Higurashi Eiji
(National Institute of Advanced Industrial Science and Technology (AIST), 1-2-1 Namiki, Tsukuba, Ibaraki, 305-8564, Japan)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2018
号:
OMN
ページ:
1-5
発行年:
2018年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)