文献
J-GLOBAL ID:201802241382898139
整理番号:18A1909060
熱シグネチャを用いた指の接触面積に基づく把持相乗解析【JST・京大機械翻訳】
Grasp Synergy Analysis Based on Contact Area of Fingers Using Thermal Signatures
著者 (8件):
Tsuji Tokuo
(University of Kanazawa, Department of Mechanical Engineering, Ishikawa, Japan)
,
Seki Hidetoshi
(University of Kanazawa, Department of Mechanical Engineering, Ishikawa, Japan)
,
Inada Daisuke
(University of Kyusyu, Faculty of Information Science and Electrical Engineering, Fukuoka, Japan)
,
Morooka Ken-ichi
(University of Kyusyu, Faculty of Information Science and Electrical Engineering, Fukuoka, Japan)
,
Harada Kensuke
(Graduate School of Engineering Science, University of Osaka, Department of Systems Innovation, Osaka, Japan)
,
Tahara Kenji
(University of Kyusyu, Department of Mechanical Engineering, Fukuoka, Japan)
,
Hikizu Masatoshi
(University of Kanazawa, Department of Mechanical Engineering, Ishikawa, Japan)
,
Seki Hiroaki
(University of Kanazawa, Department of Mechanical Engineering, Ishikawa, Japan)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2018
号:
SICE
ページ:
1386-1392
発行年:
2018年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)