文献
J-GLOBAL ID:201802241858063531
整理番号:18A2043757
複数の再流れを受ける異なるCu濃度を持つSn-Cu系はんだペーストの微細構造進展【JST・京大機械翻訳】
Microstructure Evolution of Sn-Cu Based Solder Paste with Different Cu Concentration Subjected to Multiple Reflows
著者 (4件):
Said Rita Mohd
(Universiti Malaysia Perlis (UniMAP), Centre of Excellence Geopolymer System Research and Green Technology, School of Materials Engineering; Taman Muhibbah, Jejawi, Arau, Malaysia, 02600)
,
Salleh Mohd Arif Anuar Mohd
(Universiti Malaysia Perlis (UniMAP), Centre of Excellence Geopolymer System Research and Green Technology, School of Materials Engineering; Taman Muhibbah, Jejawi, Arau, Malaysia, 02600)
,
Amran Nur Ain Athirah
(Universiti Malaysia Perlis (UniMAP), Centre of Excellence Geopolymer System Research and Green Technology, School of Materials Engineering; Taman Muhibbah, Jejawi, Arau, Malaysia, 02600)
,
Ramli Mohd Izrul Izwan
(Universiti Malaysia Perlis (UniMAP), Centre of Excellence Geopolymer System Research and Green Technology, School of Materials Engineering; Taman Muhibbah, Jejawi, Arau, Malaysia, 02600)
資料名:
Solid State Phenomena
(Solid State Phenomena)
巻:
280
ページ:
206-211
発行年:
2018年
JST資料番号:
T0583A
ISSN:
1012-0394
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
スイス (CHE)
言語:
英語 (EN)