文献
J-GLOBAL ID:201802242101969869
整理番号:18A1900273
マイクロビアにおけるSiC/Cuの共堆積に及ぼすCTABの二重効果【JST・京大機械翻訳】
Dual Effects of CTAB on Co-deposition of SiC/Cu in Micro Via
著者 (5件):
Wu Houya
(College of Mechanical and Electrical Engineering, Central South University, Changsha, China)
,
Wang Fuliang
(College of Mechanical and Electrical Engineering, Central South University, Changsha, China)
,
Wang Yan
(College of Mechanical and Electrical Engineering, Central South University, Changsha, China)
,
Zhu Wenhui
(College of Mechanical and Electrical Engineering, Central South University, Changsha, China)
,
Li Zhiyi
(College of Mechanical and Electrical Engineering, Central South University, Changsha, China)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2018
号:
ICEPT
ページ:
1317-1321
発行年:
2018年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)