文献
J-GLOBAL ID:201802244571539880
整理番号:18A0448450
付加真空エレクトロニクス:銅の電子ビーム融解【Powered by NICT】
Additive vacuum electronics: Electron beam melting of copper
著者 (7件):
Gamzina D.
(Dept. of Electrical and Computer Engineering UC Davis, CA, USA)
,
Luhmann N. C.
(Dept. of Electrical and Computer Engineering UC Davis, CA, USA)
,
Ledford C.
(Center for Additive Manufacturing and Logistics North Carolina State University, Raleigh, USA)
,
Horn T.
(Center for Additive Manufacturing and Logistics North Carolina State University, Raleigh, USA)
,
Karakaut I.
(Dept. of Mechanical Engineering UC Berkeley, CA, USA)
,
Lin L.
(Dept. of Mechanical Engineering UC Berkeley, CA, USA)
,
Frigola P.
(Radiabeam Technologies, Inc. Santa Monica, CA, USA)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2017
号:
IVEC
ページ:
1-2
発行年:
2017年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)