文献
J-GLOBAL ID:201802250162288187
整理番号:18A2071023
固定研磨パッドによるサファイアウエハのラッピングに及ぼすアブレシブ粒子サイズの影響【JST・京大機械翻訳】
Effect of Abrasive Particle Size on Lapping of Sapphire Wafer by Fixed Abrasive Pad
著者 (5件):
Wang Jian Bin
(Anhui Polytechnic University, School of Mechanical and Automobile Engineering, Anhui Engineering Technology Research Center of Automobile New Technology; Wuhu, China, 241000)
,
Li Zhen
(Anhui Polytechnic University, School of Mechanical and Automobile Engineering, Anhui Engineering Technology Research Center of Automobile New Technology; Wuhu, China, 241000)
,
Zhu Yong Wei
(Nanjing University of Aeronautics and Astronautics, Jiangsu Key Laboratory of precision and micro-manufacturing technology, College of Mechanical and Electrical Engineering; Nanjing, China, 210016)
,
Jiang Ben Chi
(Anhui Polytechnic University, School of Mechanical and Automobile Engineering, Anhui Engineering Technology Research Center of Automobile New Technology; Wuhu, China, 241000)
,
Shi Pei Cheng
(Anhui Polytechnic University, School of Mechanical and Automobile Engineering, Anhui Engineering Technology Research Center of Automobile New Technology; Wuhu, China, 241000)
資料名:
Key Engineering Materials
(Key Engineering Materials)
巻:
764
ページ:
106-114
発行年:
2018年
JST資料番号:
D0744C
ISSN:
1013-9826
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
スイス (CHE)
言語:
英語 (EN)