文献
J-GLOBAL ID:201802251655323481
整理番号:18A0442568
高帯域幅メモリ(HBM)のための埋込みマルチチップ相互接続橋(EMIB)技術を用いた不均一統合の信号と電力の完全性(SI/PI)解析【Powered by NICT】
Signal and power integrity (SI/PI) analysis of heterogeneous integration using embedded multi-die interconnect bridge (EMIB) technology for high bandwidth memory (HBM)
著者 (8件):
Cho Kyungjun
(Department of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea)
,
Kim Youngwoo
(Department of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea)
,
Lee Hyunsuk
(Department of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea)
,
Park Gapyeol
(Department of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea)
,
Kim Subin
(Department of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea)
,
Son Kyungjune
(Department of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea)
,
Choi Sumin
(Department of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea)
,
Kim Joungho
(Department of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2017
号:
EDAPS
ページ:
1-3
発行年:
2017年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)