文献
J-GLOBAL ID:201802253778317843
整理番号:18A0155419
ホットエンボス加工に使用される炭化結合グラフェン被覆シリコンウエハの加熱挙動の研究【Powered by NICT】
Investigation of the heating behavior of carbide-bonded graphene coated silicon wafer used for hot embossing
著者 (5件):
Yang Gao
(The State Key Laboratory of Ultraprecision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Kowloon, Hong Kong)
,
Li Lihua
(The State Key Laboratory of Ultraprecision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Kowloon, Hong Kong)
,
Lee Wing Bun
(The State Key Laboratory of Ultraprecision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Kowloon, Hong Kong)
,
Ng Man Cheung
(The State Key Laboratory of Ultraprecision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Kowloon, Hong Kong)
,
Chan Chang Yuen
(The State Key Laboratory of Ultraprecision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Kowloon, Hong Kong)
資料名:
Applied Surface Science
(Applied Surface Science)
巻:
435
ページ:
130-140
発行年:
2018年
JST資料番号:
B0707B
ISSN:
0169-4332
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)