文献
J-GLOBAL ID:201802254364800012
整理番号:18A1364700
薄い適合抵抗センサを用いた軟質材料における熱輸送特性の定量的キャラクタリゼーションのための先進的アプローチ【JST・京大機械翻訳】
Advanced approaches for quantitative characterization of thermal transport properties in soft materials using thin, conformable resistive sensors
著者 (18件):
Crawford Kaitlyn E.
(Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA)
,
Crawford Kaitlyn E.
(Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA)
,
Crawford Kaitlyn E.
(Department of Materials Science and Engineering, University of Central Florida, Orlando, FL 32816, USA)
,
Ma Yinji
(AML, Department of Engineering Mechanics, Interdisciplinary Research Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China)
,
Krishnan Siddharth
(Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA)
,
Krishnan Siddharth
(Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA)
,
Wei Chen
(Departments of Civil and Environmental Engineering, Mechanical Engineering, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA)
,
Capua Daniel
(Department of Biomedical Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA)
,
Xue Yeguang
(Departments of Civil and Environmental Engineering, Mechanical Engineering, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA)
,
Xu Shuai
(Department of Dermatology, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA)
,
Xie Zhaoqian
(Departments of Civil and Environmental Engineering, Mechanical Engineering, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA)
,
Won Sang Min
(Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA)
,
Tian Limei
(Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA)
,
Webb Chad
(Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA)
,
Li Yajing
(Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA)
,
Feng Xue
(AML, Department of Engineering Mechanics, Interdisciplinary Research Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China)
,
Huang Yonggang
(Departments of Civil and Environmental Engineering, Mechanical Engineering, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA)
,
Rogers John A.
(Departments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, and Neurological Surgery, Center for Bio-Integrated Electronics, Simpson Querrey Institute for Nano/biotechnology, Northwestern Univers...)
資料名:
Extreme Mechanics Letters
(Extreme Mechanics Letters)
巻:
22
ページ:
27-35
発行年:
2018年
JST資料番号:
W3055A
ISSN:
2352-4316
資料種別:
逐次刊行物 (A)
記事区分:
短報
発行国:
オランダ (NLD)
言語:
英語 (EN)