文献
J-GLOBAL ID:201802255898133787
整理番号:18A0707097
田口-グレイおよびエントロピー法を用いたSOCのためのはんだペースト堆積のプロセスパラメータ最適化【JST・京大機械翻訳】
Process Parameter Optimization of Solder Paste Deposition for SoC Using Taguchi-Grey and Entropy Approach
著者 (4件):
Liu Zhiwen
(Institute of Intelligent Manufacturing and Information Engineering, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, China)
,
Ming Xinguo
(Institute of Intelligent Manufacturing and Information Engineering, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, China)
,
Qu Yuanju
(Institute of Intelligent Manufacturing and Information Engineering, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, China)
,
Li Xiuzhen
(Institute of Intelligent Manufacturing and Information Engineering, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, China)
資料名:
IEEE Transactions on Components, Packaging, and Manufacturing Technology
(IEEE Transactions on Components, Packaging, and Manufacturing Technology)
巻:
8
号:
3
ページ:
482-491
発行年:
2018年
JST資料番号:
W0590B
ISSN:
2156-3950
CODEN:
ITCPC8
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)