文献
J-GLOBAL ID:201802256500380984
整理番号:18A1512245
マイクロフルードおよびハーメチックセラーリング応用のためのTi/Siのケイ化物ベース低温および低圧ボンディング【JST・京大機械翻訳】
Silicide Based Low Temperature and Low Pressure Bonding of TI/SI for Microfludic and Hermetic Selaling Application
著者 (7件):
Kumar C Hemanth
(Indian Institute of Technology Hyderabad, Department of Electrical Engineering, Sangareddy, India)
,
Pnaigrahi Asisa Kumar
(Indian Institute of Technology Hyderabad, Department of Electrical Engineering, Sangareddy, India)
,
Paul Nirupam
(Indian Institute of Technology Hyderabad, Department of Electrical Engineering, Sangareddy, India)
,
Bonam Satish
(Indian Institute of Technology Hyderabad, Department of Electrical Engineering, Sangareddy, India)
,
Krishna Vanjari Siva Rama
(Indian Institute of Technology Hyderabad, Department of Electrical Engineering, Sangareddy, India)
,
Singh Shiv Govind
(Indian Institute of Technology Hyderabad, Department of Electrical Engineering, Sangareddy, India)
,
Panigrahi Asisa Kumar
(Indian Institute of Technology Hyderabad, Department of Electrical Engineering, Sangareddy, India)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2018
号:
IITC
ページ:
91-93
発行年:
2018年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)