文献
J-GLOBAL ID:201802258033535271
整理番号:18A0848417
Millerプラトー幅によるIGBTのオンライン接合温度抽出とエージング検出【JST・京大機械翻訳】
Online junction temperature extraction and aging detection of IGBT via Miller plateau width
著者 (7件):
Liu Jingcun
(State Key Laboratory of Electrical Insulation and Power Equipment, Xi’an Jiaotong University, Xi’an, China)
,
Zhang Guogang
(State Key Laboratory of Electrical Insulation and Power Equipment, Xi’an Jiaotong University, Xi’an, China)
,
Chen Qian
(State Key Laboratory of Electrical Insulation and Power Equipment, Xi’an Jiaotong University, Xi’an, China)
,
Qi Lu
(State Key Laboratory of Electrical Insulation and Power Equipment, Xi’an Jiaotong University, Xi’an, China)
,
Qin Zheng
(State Key Laboratory of Electrical Insulation and Power Equipment, Xi’an Jiaotong University, Xi’an, China)
,
Wang Jianhua
(State Key Laboratory of Electrical Insulation and Power Equipment, Xi’an Jiaotong University, Xi’an, China)
,
Geng Yingsan
(State Key Laboratory of Electrical Insulation and Power Equipment, Xi’an Jiaotong University, Xi’an, China)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2018
号:
APEC
ページ:
2813-2820
発行年:
2018年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)