文献
J-GLOBAL ID:201802267591771370
整理番号:18A0133155
ふっ素化シリカベースの超疎水性被覆によるプリント配線板の耐候性障壁増強【Powered by NICT】
Weathering barrier enhancement of printed circuit board by fluorinated silica based superhydrophobic coating
著者 (4件):
Wan Shan
(Hubei Key Laboratory of Material Chemistry and Service Failure, School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China)
,
Cong Yun
(Zhoushan branch, State Grid Corporation of China, Zhejiang, 310007, China)
,
Jiang Dan
(Hubei Key Laboratory of Material Chemistry and Service Failure, School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China)
,
Dong Ze-Hua
(Hubei Key Laboratory of Material Chemistry and Service Failure, School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China)
資料名:
Colloids and Surfaces. A. Physicochemical and Engineering Aspects
(Colloids and Surfaces. A. Physicochemical and Engineering Aspects)
巻:
538
ページ:
628-638
発行年:
2018年
JST資料番号:
A0539B
ISSN:
0927-7757
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)