文献
J-GLOBAL ID:201802279019952726
整理番号:18A1900120
等方性導電性接着剤の硬化動力学と熱抵抗の研究【JST・京大機械翻訳】
Study of the curing kinetics and heat resistance of isotropic conductive adhesive
著者 (3件):
Jiang Han
(Lab of Smart Materials and Electronic Packaging in School of Materials Science and Engineering, and Guangdong Provincial Engineering Technology R&D Center of Electronic Packaging Materials and Reliability, South China University of Technology, Guangzhou, 510640, China)
,
Zhou Min-Bo
(Lab of Smart Materials and Electronic Packaging in School of Materials Science and Engineering, and Guangdong Provincial Engineering Technology R&D Center of Electronic Packaging Materials and Reliability, South China University of Technology, Guangzhou, 510640, China)
,
Zhang Xin-Ping
(Lab of Smart Materials and Electronic Packaging in School of Materials Science and Engineering, and Guangdong Provincial Engineering Technology R&D Center of Electronic Packaging Materials and Reliability, South China University of Technology, Guangzhou, 510640, China)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2018
号:
ICEPT
ページ:
633-637
発行年:
2018年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)