文献
J-GLOBAL ID:201802285284867454
整理番号:18A1043433
電力サイクル中の焼結ナノ銀と高鉛はんだダイアタッチメントの比較熱的および構造的特性評価【JST・京大機械翻訳】
Comparative Thermal and Structural Characterization of Sintered Nano-Silver and High-Lead Solder Die Attachments During Power Cycling
著者 (5件):
Dai Jingru
(Department of Electrical and Electronic Engineering, University of Nottingham, Nottingham, U.K.)
,
Li Jianfeng
(Department of Electrical and Electronic Engineering, University of Nottingham, Nottingham, U.K.)
,
Agyakwa Pearl
(Department of Electrical and Electronic Engineering, University of Nottingham, Nottingham, U.K.)
,
Corfield Martin
(Department of Electrical and Electronic Engineering, University of Nottingham, Nottingham, U.K.)
,
Johnson Christopher Mark
(Department of Electrical and Electronic Engineering, University of Nottingham, Nottingham, U.K.)
資料名:
IEEE Transactions on Device and Materials Reliability
(IEEE Transactions on Device and Materials Reliability)
巻:
18
号:
2
ページ:
256-265
発行年:
2018年
JST資料番号:
W1320A
ISSN:
1530-4388
CODEN:
ITDMA2
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)