文献
J-GLOBAL ID:201802289478973736
整理番号:18A0465007
ポリスチレン(PS)とPS SiO_2マイクロカプセル化パラフィンワックス(MePW)を用いたPWベースHTPB粘結剤の増強された熱的及び機械的性質【Powered by NICT】
Enhanced thermal and mechanical properties of PW-based HTPB binder using polystyrene (PS) and PS-SiO2 microencapsulated paraffin wax (MePW)
著者 (9件):
Gao Xia
(Key Laboratory of Cluster Science of Ministry of Education, Beijing Institute of Technology, Beijing 100081, People’s Republic of China)
,
Gao Xia
(China Academy of Engineering Physics (CAEP), Institute of Chemical Materials, Mianyang 621900, People’s Republic of China)
,
Zhao Tianbo
(Key Laboratory of Cluster Science of Ministry of Education, Beijing Institute of Technology, Beijing 100081, People’s Republic of China)
,
Luo Guan
(China Academy of Engineering Physics (CAEP), Institute of Chemical Materials, Mianyang 621900, People’s Republic of China)
,
Zheng Baohui
(China Academy of Engineering Physics (CAEP), Institute of Chemical Materials, Mianyang 621900, People’s Republic of China)
,
Huang Hui
(China Academy of Engineering Physics (CAEP), Institute of Chemical Materials, Mianyang 621900, People’s Republic of China)
,
Ma Rui
(Key Laboratory of Cluster Science of Ministry of Education, Beijing Institute of Technology, Beijing 100081, People’s Republic of China)
,
Han Xue
(Key Laboratory of Cluster Science of Ministry of Education, Beijing Institute of Technology, Beijing 100081, People’s Republic of China)
,
Chai Yuqiao
(Key Laboratory of Cluster Science of Ministry of Education, Beijing Institute of Technology, Beijing 100081, People’s Republic of China)
資料名:
Journal of Applied Polymer Science
(Journal of Applied Polymer Science)
巻:
135
号:
18
ページ:
ROMBUNNO.46222
発行年:
2018年
JST資料番号:
C0467A
ISSN:
0021-8995
CODEN:
JAPNAB
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)