文献
J-GLOBAL ID:201902223190911370
整理番号:19A2442254
固定輪郭3D ICのための温度意識フロア計画【JST・京大機械翻訳】
Temperature-Aware Floorplanning for Fixed-Outline 3D ICs
著者 (8件):
Ni Tianming
(College of Electrical Engineering, Anhui Polytechnic University, Wuhu, China)
,
Chang Hao
(Department of Computer Science and Technology, Anhui University of Finance and Economics, Bengbu, China)
,
Zhu Shidong
(College of Electrical Engineering, Anhui Polytechnic University, Wuhu, China)
,
Lu Lin
(College of Electrical Engineering, Anhui Polytechnic University, Wuhu, China)
,
Li Xueyun
(School of Electronic Science and Applied Physics, Hefei University of Technology, Hefei, China)
,
Xu Qi
(School of Electronic Science and Applied Physics, Hefei University of Technology, Hefei, China)
,
Liang Huaguo
(School of Electronic Science and Applied Physics, Hefei University of Technology, Hefei, China)
,
Huang Zhengfeng
(School of Electronic Science and Applied Physics, Hefei University of Technology, Hefei, China)
資料名:
IEEE Access
(IEEE Access)
巻:
7
ページ:
139787-139794
発行年:
2019年
JST資料番号:
W2422A
ISSN:
2169-3536
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)