文献
J-GLOBAL ID:201902249483486508
整理番号:19A1771434
EWLBパッケージング技術における+100GHz相互接続の実証【JST・京大機械翻訳】
Demonstration of +100-GHz Interconnects in eWLB Packaging Technology
著者 (7件):
Hassona Ahmed
(Department of Microtechnology and Nanoscience-MC2, Chalmers University of Technology, Goeteborg, Sweden)
,
He Zhongxia Simon
(Department of Microtechnology and Nanoscience-MC2, Chalmers University of Technology, Goeteborg, Sweden)
,
Vassilev Vessen
(Department of Microtechnology and Nanoscience-MC2, Chalmers University of Technology, Goeteborg, Sweden)
,
Mariotti Chiara
(Infineon Technologies Austria AG, Villach, Austria)
,
Gunnarsson Sten E.
(Department of Microtechnology and Nanoscience-MC2, Chalmers University of Technology, Goeteborg, Sweden)
,
Dielacher Franz
(Infineon Technologies Austria AG, Villach, Austria)
,
Zirath Herbert
(Department of Microtechnology and Nanoscience-MC2, Chalmers University of Technology, Goeteborg, Sweden)
資料名:
IEEE Transactions on Components, Packaging, and Manufacturing Technology
(IEEE Transactions on Components, Packaging, and Manufacturing Technology)
巻:
9
号:
7
ページ:
1406-1414
発行年:
2019年
JST資料番号:
W0590B
ISSN:
2156-3950
CODEN:
ITCPC8
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)