文献
J-GLOBAL ID:201902257330545161
整理番号:19A2161204
電着により合成した高熱伝導性Cu-ダイヤモンド複合材料とボイドフリー複合材料への添加物の臨界効果【JST・京大機械翻訳】
High thermal conductive Cu-diamond composites synthesized by electrodeposition and the critical effects of additives on void-free composites
著者 (6件):
Wu Yongpeng
(National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China)
,
Tang Zhiyong
(National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China)
,
Wang Yan
(National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China)
,
Cheng Ping
(National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China)
,
Wang Hong
(National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China)
,
Ding Guifu
(National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China)
資料名:
Ceramics International
(Ceramics International)
巻:
45
号:
16
ページ:
19658-19668
発行年:
2019年
JST資料番号:
H0705A
ISSN:
0272-8842
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)