文献
J-GLOBAL ID:201902287836346986
整理番号:19A0511721
絶縁材料としてシリコングリースを用いたGdBCOコイルの熱クエンチ挙動に関する研究【JST・京大機械翻訳】
Study on Thermal-Quench Behaviors of GdBCO Coils Wound With Silicon Grease as an Insulation Material
著者 (8件):
Kim Seong-Gyeom
(Department of Material Science and Engineering, Korea University, Seoul, South Korea)
,
Choi Yoon Hyuck
(Department of Material Science and Engineering, Korea University, Seoul, South Korea)
,
Yang Dong Gyu
(Department of Material Science and Engineering, Korea University, Seoul, South Korea)
,
Jeong Seol-Hee
(Department of Material Science and Engineering, Korea University, Seoul, South Korea)
,
Kim Ji Hyung
(Department of Electrical Engineering, Jeju National University, Jeju, South Korea)
,
Kim Ho-Min
(Department of Material Science and Engineering, Korea University, Seoul, South Korea)
,
Choi Yeon Suk
(Korea Basic Science Institute, Daejeon, South Korea)
,
Lee Haigun
(Department of Material Science and Engineering, Korea University, Seoul, South Korea)
資料名:
IEEE Transactions on Applied Superconductivity
(IEEE Transactions on Applied Superconductivity)
巻:
27
号:
4
ページ:
ROMBUNNO.4700905.1-5
発行年:
2017年
JST資料番号:
W0177A
ISSN:
1051-8223
CODEN:
ITASE9
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)