文献
J-GLOBAL ID:202002212791057666
整理番号:20A2301060
整列エレクトロスピンニング繊維が高密度で充填した生体機能足場は神経再生を支援する
Biofunctional scaffolds with high packing density of aligned electrospun fibers support neural regeneration
著者 (6件):
Cnops Vanja
(School of Chemical and Biomedical Engineering, Nanyang Technological University, Singapore, Singapore)
,
Chin Jiah Shin
(School of Chemical and Biomedical Engineering, Nanyang Technological University, Singapore, Singapore)
,
Chin Jiah Shin
(NTU Institute of Health Technologies, Interdisciplinary Graduate School, Nanyang Technological University, Singapore, Singapore)
,
Milbreta Ulla
(School of Chemical and Biomedical Engineering, Nanyang Technological University, Singapore, Singapore)
,
Chew Sing Yian
(School of Chemical and Biomedical Engineering, Nanyang Technological University, Singapore, Singapore)
,
Chew Sing Yian
(Lee Kong Chian School of Medicine, Nanyang Technological University, Singapore, Singapore)
資料名:
Journal of Biomedical Materials Research. Part A
(Journal of Biomedical Materials Research. Part A)
巻:
108
号:
12
ページ:
2473-2483
発行年:
2020年12月
JST資料番号:
E0528B
ISSN:
1549-3296
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)