文献
J-GLOBAL ID:202002220360496837
整理番号:20A0198864
Bi-Te系熱電材料の接合界面拡散挙動に及ぼすNi障壁の微細構造の影響【JST・京大機械翻訳】
Effects of microstructure of Ni barrier on bonding interface diffusion behaviors of Bi-Te-based thermoelectric material
著者 (5件):
Yusufu Ekubaru
(Department of Advanced Interconnection Materials, The Institute of Scientific and Industrial Research, Osaka University, Mihogaoka 8-1, Ibaraki, Osaka, 567-0047, Japan)
,
Sugahara Tohru
(Department of Advanced Interconnection Materials, The Institute of Scientific and Industrial Research, Osaka University, Mihogaoka 8-1, Ibaraki, Osaka, 567-0047, Japan)
,
Okajima Michio
(E-ThermoGentek Co., Ltd., 102 Kujyo CID bld., 13, Shimotonodacho, Higashikujo, Minami-ku, Kyoto, 601-8047, Japan)
,
Nambu Shutaro
(E-ThermoGentek Co., Ltd., 102 Kujyo CID bld., 13, Shimotonodacho, Higashikujo, Minami-ku, Kyoto, 601-8047, Japan)
,
Suganuma Katsuaki
(Department of Advanced Interconnection Materials, The Institute of Scientific and Industrial Research, Osaka University, Mihogaoka 8-1, Ibaraki, Osaka, 567-0047, Japan)
資料名:
Journal of Alloys and Compounds
(Journal of Alloys and Compounds)
巻:
817
ページ:
Null
発行年:
2020年
JST資料番号:
D0083A
ISSN:
0925-8388
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)