文献
J-GLOBAL ID:202002221285266469
整理番号:20A2260293
銅電気めっきによるテーパ付きTGVビアの充填に及ぼす添加剤の相乗効果【JST・京大機械翻訳】
Synergistic Effect of Additives on Filling of Tapered TGV Vias by Copper Electroplating
著者 (5件):
Wu Shanshan
(School of Materials Science and Engineering Shanghai Jiao Tong University,State Key Laboratory of Metal Matrix Composites,Shanghai,China)
,
Ling Huiqin
(School of Materials Science and Engineering Shanghai Jiao Tong University,State Key Laboratory of Metal Matrix Composites,Shanghai,China)
,
Xie Yitong
(School of Materials Science and Engineering Shanghai Jiao Tong University,State Key Laboratory of Metal Matrix Composites,Shanghai,China)
,
Li Ming
(School of Materials Science and Engineering Shanghai Jiao Tong University,State Key Laboratory of Metal Matrix Composites,Shanghai,China)
,
Yu Daquan
(Xiamen University,School of Electronic Science and Engineering,Xiamen,China)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2020
号:
ICEPT
ページ:
1-4
発行年:
2020年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)