文献
J-GLOBAL ID:202002231456472768
整理番号:20A2648339
大面積はんだ接合の寿命評価と予測法【JST・京大機械翻訳】
A lifetime assessment and prediction method for large area solder joints
著者 (3件):
Lederer M.
(Christian Doppler Laboratory for Lifetime and Reliability of Interfaces in Complex Multi-Material Electronics, Institute of Chemical Technologies and Analytics, Vienna Universtity of Technology, Getreidemarkt 9/164 1060 Vienna, Austria)
,
Kotas A. Betzwar
(Christian Doppler Laboratory for Lifetime and Reliability of Interfaces in Complex Multi-Material Electronics, Institute of Chemical Technologies and Analytics, Vienna Universtity of Technology, Getreidemarkt 9/164 1060 Vienna, Austria)
,
Khatibi G.
(Christian Doppler Laboratory for Lifetime and Reliability of Interfaces in Complex Multi-Material Electronics, Institute of Chemical Technologies and Analytics, Vienna Universtity of Technology, Getreidemarkt 9/164 1060 Vienna, Austria)
資料名:
Microelectronics Reliability
(Microelectronics Reliability)
巻:
114
ページ:
Null
発行年:
2020年
JST資料番号:
C0530A
ISSN:
0026-2714
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)