文献
J-GLOBAL ID:202002232206453509
整理番号:20A0792719
低温無圧力でのミクロンスケール焼結Ag接合によるENEPIG基板上のロバスト結合と熱安定Ag-Au接合【JST・京大機械翻訳】
Robust bonding and thermal-stable Ag-Au joint on ENEPIG substrate by micron-scale sinter Ag joining in low temperature pressure-less
著者 (12件):
Chen Chuantong
(Institute of Scientific and Industrial Research, Osaka University. 8-1, Mihogaoka, Ibaraki, Osaka, 567-0047, Japan)
,
Zhang Zheng
(Institute of Scientific and Industrial Research, Osaka University. 8-1, Mihogaoka, Ibaraki, Osaka, 567-0047, Japan)
,
Zhang Zheng
(Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University. 1-1, Yamadaoka, Suita, Osaka, 565-0871, Japan)
,
Wang Qian
(Joining and Welding Research Institute, Osaka University. 11-1, Mihogaoka, Ibaraki, Osaka, 567-0047, Japan)
,
Zhang Bowen
(Institute of Scientific and Industrial Research, Osaka University. 8-1, Mihogaoka, Ibaraki, Osaka, 567-0047, Japan)
,
Zhang Bowen
(Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University. 1-1, Yamadaoka, Suita, Osaka, 565-0871, Japan)
,
Gao Yue
(Institute of Scientific and Industrial Research, Osaka University. 8-1, Mihogaoka, Ibaraki, Osaka, 567-0047, Japan)
,
Gao Yue
(Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University. 1-1, Yamadaoka, Suita, Osaka, 565-0871, Japan)
,
Sasamura Tetsuya
(Central Research Laboratory, C. Uyemura&Co., Ltd. 1-5-1, Deguchi, Hirakata, Osaka, 573-0065, Japan)
,
Oda Yukinori
(Central Research Laboratory, C. Uyemura&Co., Ltd. 1-5-1, Deguchi, Hirakata, Osaka, 573-0065, Japan)
,
Ma Ninshu
(Joining and Welding Research Institute, Osaka University. 11-1, Mihogaoka, Ibaraki, Osaka, 567-0047, Japan)
,
Suganuma Katsuaki
(Institute of Scientific and Industrial Research, Osaka University. 8-1, Mihogaoka, Ibaraki, Osaka, 567-0047, Japan)
資料名:
Journal of Alloys and Compounds
(Journal of Alloys and Compounds)
巻:
828
ページ:
Null
発行年:
2020年
JST資料番号:
D0083A
ISSN:
0925-8388
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)