文献
J-GLOBAL ID:202002238484354612
整理番号:20A1073925
印刷フレキシブルエレクトロニクスのための低温焼結可能なバイモーダルコア-シェル構造Cu-Agナノ粒子ベース導電性インク【JST・京大機械翻訳】
A bimodal core-shell structured Cu-Ag nanoparticles based conductive ink capable of low temperature sintering for printed flexible electronics
著者 (5件):
Huang Hai-Jun
(South China University of Technology,Lab of Smart Materials and Electronic Packaging in School of Materials Science and Engineering, and Guangdong Provincial Engineering Technology R&D Center of Electronic Packaging Materials and Reliability,Guangzhou,China,510640)
,
Wu Xue
(South China University of Technology,Lab of Smart Materials and Electronic Packaging in School of Materials Science and Engineering, and Guangdong Provincial Engineering Technology R&D Center of Electronic Packaging Materials and Reliability,Guangzhou,China,510640)
,
Ma Xiao
(South China University of Technology,Lab of Smart Materials and Electronic Packaging in School of Materials Science and Engineering, and Guangdong Provincial Engineering Technology R&D Center of Electronic Packaging Materials and Reliability,Guangzhou,China,510640)
,
Zhou Min-Bo
(South China University of Technology,Lab of Smart Materials and Electronic Packaging in School of Materials Science and Engineering, and Guangdong Provincial Engineering Technology R&D Center of Electronic Packaging Materials and Reliability,Guangzhou,China,510640)
,
Zhang Xin-Ping
(South China University of Technology,Lab of Smart Materials and Electronic Packaging in School of Materials Science and Engineering, and Guangdong Provincial Engineering Technology R&D Center of Electronic Packaging Materials and Reliability,Guangzhou,China,510640)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2019
号:
ICEPT
ページ:
1-4
発行年:
2019年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)