文献
J-GLOBAL ID:202002238886318276
整理番号:20A0648782
微細構造改質による電気めっきCu膜のエッチング特性の顕著な改善【JST・京大機械翻訳】
Significantly improving the etching characteristics of electroplated Cu films through microstructure modification
著者 (4件):
Lee Cheng-Yu
(Department of Chemical Engineering & Materials Science, Yuan Ze University, Chungli Dist., Taoyuan City 320, Taiwan, ROC)
,
Lin Ping-Chou
(Department of Chemical Engineering & Materials Science, Yuan Ze University, Chungli Dist., Taoyuan City 320, Taiwan, ROC)
,
Yang Cheng-Hsien
(Department of Chemical Engineering & Materials Science, Yuan Ze University, Chungli Dist., Taoyuan City 320, Taiwan, ROC)
,
Ho Cheng-En
(Department of Chemical Engineering & Materials Science, Yuan Ze University, Chungli Dist., Taoyuan City 320, Taiwan, ROC)
資料名:
Surface & Coatings Technology
(Surface & Coatings Technology)
巻:
386
ページ:
Null
発行年:
2020年
JST資料番号:
D0205C
ISSN:
0257-8972
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)