文献
J-GLOBAL ID:202002239720764748
整理番号:20A2189687
酸性塩化物環境における包装装置上の銅ワイヤボンディング故障の機構研究【JST・京大機械翻訳】
Mechanistic study of copper wire-bonding failures on packaging devices in acidic chloride environments
著者 (7件):
Ross Nick
(Interfacial Electrochemistry and Materials Research Lab, Department of Chemistry, University of North Texas, Denton, TX 76203-5017, United States of America)
,
Asokan Muthappan
(Interfacial Electrochemistry and Materials Research Lab, Department of Chemistry, University of North Texas, Denton, TX 76203-5017, United States of America)
,
Ashok Kumar Goutham Issac
(Interfacial Electrochemistry and Materials Research Lab, Department of Chemistry, University of North Texas, Denton, TX 76203-5017, United States of America)
,
Caperton Joshua
(Interfacial Electrochemistry and Materials Research Lab, Department of Chemistry, University of North Texas, Denton, TX 76203-5017, United States of America)
,
Alptekin John
(Interfacial Electrochemistry and Materials Research Lab, Department of Chemistry, University of North Texas, Denton, TX 76203-5017, United States of America)
,
Salunke Ashish Shivaji
(Interfacial Electrochemistry and Materials Research Lab, Department of Chemistry, University of North Texas, Denton, TX 76203-5017, United States of America)
,
Chyan Oliver M.
(Interfacial Electrochemistry and Materials Research Lab, Department of Chemistry, University of North Texas, Denton, TX 76203-5017, United States of America)
資料名:
Microelectronics Reliability
(Microelectronics Reliability)
巻:
113
ページ:
Null
発行年:
2020年
JST資料番号:
C0530A
ISSN:
0026-2714
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)