文献
J-GLOBAL ID:202002247498223129
整理番号:20A2293033
膜/基板系における応力,クリープおよび拡散の結合モデル【JST・京大機械翻訳】
A coupled model of stress, creep, and diffusion in the film/substrate system
著者 (4件):
Xie Feng
(State Key Laboratory for Strength and Vibration of Mechanical Structures, Department of Engineering Mechanics, School of Aerospace Engineering, Xi’an Jiaotong University, Xi’an, Shaanxi 710049, China)
,
Li Huimin
(State Key Laboratory for Strength and Vibration of Mechanical Structures, Department of Engineering Mechanics, School of Aerospace Engineering, Xi’an Jiaotong University, Xi’an, Shaanxi 710049, China)
,
Zhang Weixu
(State Key Laboratory for Strength and Vibration of Mechanical Structures, Department of Engineering Mechanics, School of Aerospace Engineering, Xi’an Jiaotong University, Xi’an, Shaanxi 710049, China)
,
Ma Qingzhong
(Guodian Science and Technology Research Institute Limited, Nanjing, Jiangsu 210023, China)
資料名:
Journal of Applied Physics
(Journal of Applied Physics)
巻:
128
号:
14
ページ:
145106-145106-14
発行年:
2020年
JST資料番号:
C0266A
ISSN:
0021-8979
CODEN:
JAPIAU
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)