文献
J-GLOBAL ID:202002254780891178
整理番号:20A0292491
低パーコレーションしきい値を有する高電気伝導率を達成するための導電性接着剤のための銀ナノワイヤとナノ銀被覆銅マイクロフレークの混合物【JST・京大機械翻訳】
The mixture of silver nanowires and nanosilver-coated copper micronflakes for electrically conductive adhesives to achieve high electrical conductivity with low percolation threshold
著者 (6件):
Wang Qian
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China)
,
Wang Qian
(Joining and Welding Research Institute, Osaka University, Mihogaoka 11-1, Ibaraki, Osaka, 567-0047, Japan)
,
Zhang Shuye
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China)
,
Liu Guiming
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China)
,
Lin Tiesong
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China)
,
He Peng
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China)
資料名:
Journal of Alloys and Compounds
(Journal of Alloys and Compounds)
巻:
820
ページ:
Null
発行年:
2020年
JST資料番号:
D0083A
ISSN:
0925-8388
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)