文献
J-GLOBAL ID:202002257608621344
整理番号:20A0130168
熱抵抗と次元安定性を効果的に改善するためのポリイミド鎖へのビス-ベンゾイミダゾールの組込み【JST・京大機械翻訳】
Incorporating bis-benzimidazole into polyimide chains for effectively improving thermal resistance and dimensional stability
著者 (5件):
Lian Meng
(Shanghai Key Laboratory of Electrical Insulation and Thermal Aging, School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai, China)
,
Zheng Feng
(School of Chemical Science and Engineering, Tongji University, Shanghai, China)
,
Wu Qi
(Shanghai Key Laboratory of Electrical Insulation and Thermal Aging, School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai, China)
,
Lu Xuemin
(Shanghai Key Laboratory of Electrical Insulation and Thermal Aging, School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai, China)
,
Lu Qinghua
(Shanghai Key Laboratory of Electrical Insulation and Thermal Aging, School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai, China)
資料名:
Polymer International
(Polymer International)
巻:
69
号:
1
ページ:
93-99
発行年:
2020年
JST資料番号:
A0918A
ISSN:
0959-8103
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)