文献
J-GLOBAL ID:202002258876386057
整理番号:20A0191197
絶縁ゲートバイポーラトランジスタモジュールの電気-熱パラメトリック劣化モデル【JST・京大機械翻訳】
An electro-thermal parametric degradation model of insulated gate bipolar transistor modules
著者 (5件):
Liu Xiangxiang
(State Key Laboratory of Reliability and Intelligence of Electrical Equipment, Hebei University of Technology, Tianjin 300000, China)
,
Liu Xiangxiang
(Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MD 20742, USA)
,
Li Lingling
(State Key Laboratory of Reliability and Intelligence of Electrical Equipment, Hebei University of Technology, Tianjin 300000, China)
,
Das Diganta
(Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MD 20742, USA)
,
Pecht Michael
(Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MD 20742, USA)
資料名:
Microelectronics Reliability
(Microelectronics Reliability)
巻:
104
ページ:
Null
発行年:
2020年
JST資料番号:
C0530A
ISSN:
0026-2714
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)