文献
J-GLOBAL ID:202002260631850307
整理番号:20A2729811
低温におけるNi中間層の種々の粒径を用いたCu/Cuの拡散接合に関する研究【JST・京大機械翻訳】
An investigation on diffusion bonding of Cu/Cu using various grain size of Ni interlayers at low temperature
著者 (7件):
Lin Tong
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China)
,
Li Chun
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China)
,
Si Xiaoqing
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China)
,
Li Xinru
(Key Laboratory of Micro-systems and Micro-structures Manufacturing of Ministry of Education, Harbin Institute of Technology, Harbin 150080, China)
,
Yang Bo
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China)
,
Feng Jicai
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China)
,
Cao Jian
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China)
資料名:
Materialia
(Materialia)
巻:
14
ページ:
Null
発行年:
2020年
JST資料番号:
W5058A
ISSN:
2589-1529
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)