文献
J-GLOBAL ID:202002261739994369
整理番号:20A1074001
ICパッケージの過渡熱抵抗解析【JST・京大機械翻訳】
Transient Thermal Resistance Analysis for IC Packages
著者 (6件):
Chen Hsin-En
(Group R&D / Stress & Thermal Lab Advanced Semiconductor Engineering (ASE), Inc.,Kaohsiung,Taiwan)
,
Yang Penny
(Group R&D / Stress & Thermal Lab Advanced Semiconductor Engineering (ASE), Inc.,Kaohsiung,Taiwan)
,
Hu Ian
(Group R&D / Stress & Thermal Lab Advanced Semiconductor Engineering (ASE), Inc.,Kaohsiung,Taiwan)
,
Shih Meng-Kai
(Group R&D / Stress & Thermal Lab Advanced Semiconductor Engineering (ASE), Inc.,Kaohsiung,Taiwan)
,
Tarng David
(Group R&D Advanced Semiconductor Engineering (ASE), Inc.,Kaohsiung,Taiwan)
,
Hung CP
(Group R&D Advanced Semiconductor Engineering (ASE), Inc.,Kaohsiung,Taiwan)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2019
号:
ICEPT
ページ:
1-4
発行年:
2019年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)