文献
J-GLOBAL ID:202002261815247736
整理番号:20A1074013
WBBGAパッケージ高端リレー保護チップの熱シミュレーションと解析【JST・京大機械翻訳】
Thermal simulation and analysis of WBBGA packaging High-end Relay Protection Chip
著者 (7件):
Han S. F.
(Beijing Engineering Research Center of High-reliability IC with Power Industrial Grade Beijing Smart-chip Microelectronics Technology Co., Ltd,State Grid Key Laboratory of Power Industrial Chip Design and Analysis Technology,Beijing,China)
,
Tang X. K.
(Beijing Engineering Research Center of High-reliability IC with Power Industrial Grade Beijing Smart-chip Microelectronics Technology Co., Ltd,State Grid Key Laboratory of Power Industrial Chip Design and Analysis Technology,Beijing,China)
,
Li D. J.
(Beijing Engineering Research Center of High-reliability IC with Power Industrial Grade Beijing Smart-chip Microelectronics Technology Co., Ltd,State Grid Key Laboratory of Power Industrial Chip Design and Analysis Technology,Beijing,China)
,
Guan Y.
(Beijing Engineering Research Center of High-reliability IC with Power Industrial Grade Beijing Smart-chip Microelectronics Technology Co., Ltd,State Grid Key Laboratory of Power Industrial Chip Design and Analysis Technology,Beijing,China)
,
Li B. F.
(Beijing Engineering Research Center of High-reliability IC with Power Industrial Grade Beijing Smart-chip Microelectronics Technology Co., Ltd,State Grid Key Laboratory of Power Industrial Chip Design and Analysis Technology,Beijing,China)
,
Wang X. Y.
(Guilin University of Electronic Technology,College of Mechanical and Electrical Engineering,Guilin,China)
,
Yang D. G.
(Guilin University of Electronic Technology,College of Mechanical and Electrical Engineering,Guilin,China)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2019
号:
ICEPT
ページ:
1-5
発行年:
2019年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)