文献
J-GLOBAL ID:202002262441043181
整理番号:20A2700683
分子動力学に基づく単結晶シリコン切断プロセスに及ぼす工具半径の影響の解析【JST・京大機械翻訳】
Analysis of the influence of tool radius on single crystal silicon cutting process based on Molecular dynamics
著者 (4件):
Lai Lianfeng
(School of Information and Electromechanical Engineering, Ningde Normal University, Ningde, China)
,
Niu Qinchuan
(School of Information and Electromechanical Engineering, Ningde Normal University, Ningde, China)
,
Niu Qinchuan
(School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, China)
,
Li Minglin
(School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, China)
資料名:
Journal of Physics: Conference Series
(Journal of Physics: Conference Series)
巻:
1650
号:
2
ページ:
022056 (8pp)
発行年:
2020年
JST資料番号:
W5565A
ISSN:
1742-6588
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)