文献
J-GLOBAL ID:202002267229082072
整理番号:20A2776149
組合せ温度サイクルと電流スイッチサイクル試験の下でのAu_80Sn_20/AlN基板はんだ接合の故障を引き起こす特性形態【JST・京大機械翻訳】
Characteristic morphologies that cause failure of Au80Sn20/AlN substrate solder joint under combined temperature cycle and current switch cycle tests
著者 (5件):
Lin Ping
(National Key Laboratory of Science and Technology for National Defence on High-strength Structural Materials, Central South University, Changsha, China)
,
Liu Wensheng
(National Key Laboratory of Science and Technology for National Defence on High-strength Structural Materials, Central South University, Changsha, China)
,
Ma Yunzhu
(National Key Laboratory of Science and Technology for National Defence on High-strength Structural Materials, Central South University, Changsha, China)
,
Huang Yufeng
(National Key Laboratory of Science and Technology for National Defence on High-strength Structural Materials, Central South University, Changsha, China)
,
Tang Siwei
(National Key Laboratory of Science and Technology for National Defence on High-strength Structural Materials, Central South University, Changsha, China)
資料名:
Journal of Materials Science. Materials in Electronics
(Journal of Materials Science. Materials in Electronics)
巻:
31
号:
21
ページ:
19013-19024
発行年:
2020年
JST資料番号:
W0003A
ISSN:
0957-4522
CODEN:
JMTSAS
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
ドイツ (DEU)
言語:
英語 (EN)