文献
J-GLOBAL ID:202002268227891174
整理番号:20A0647614
研磨パッドの粘弾性挙動:シリコンウエハ研磨中のエッジロールオフに及ぼす影響【JST・京大機械翻訳】
Viscoelastic behavior of polishing pad: Effects on edge roll-off during silicon wafer polishing
著者 (3件):
Satake Urara
(Department of Mechanical Engineering, Graduate School of Engineering, Osaka University, 2-1, Yamada-oka, Suita, Osaka, 565-0871, Japan)
,
Harada Sena
(Department of Mechanical Engineering, Graduate School of Engineering, Osaka University, 2-1, Yamada-oka, Suita, Osaka, 565-0871, Japan)
,
Enomoto Toshiyuki
(Department of Mechanical Engineering, Graduate School of Engineering, Osaka University, 2-1, Yamada-oka, Suita, Osaka, 565-0871, Japan)
資料名:
Precision Engineering
(Precision Engineering)
巻:
62
ページ:
30-39
発行年:
2020年
JST資料番号:
A0734B
ISSN:
0141-6359
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)