文献
J-GLOBAL ID:202002277476507304
整理番号:20A1688364
基板集積導波路技術を用いた付加製造電磁ベース平面圧力センサ【JST・京大機械翻訳】
Additively manufactured electromagnetic based planar pressure sensor using substrate integrated waveguide technology
著者 (4件):
Kim Yeonju
(School of Electrical and Electronics Engineering, Chung-Ang University, Seoul, 06974, Republic of Korea)
,
Cui Yepu
(School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, 30332, USA)
,
Tentzeris Manos M.
(School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, 30332, USA)
,
Lim Sungjoon
(School of Electrical and Electronics Engineering, Chung-Ang University, Seoul, 06974, Republic of Korea)
資料名:
Additive Manufacturing
(Additive Manufacturing)
巻:
34
ページ:
Null
発行年:
2020年
JST資料番号:
W3016A
ISSN:
2214-8604
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)