文献
J-GLOBAL ID:202002287310353406
整理番号:20A2471194
高電流密度下のCuコアはんだ接合のエレクトロマイグレーション挙動【JST・京大機械翻訳】
Electromigration Behavior of Cu Core Solder Joints Under High Current Density
著者 (6件):
Jeong Haksan
(School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, South Korea)
,
Lee Choong-Jae
(School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, South Korea)
,
Kim Jae-Ha
(School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, South Korea)
,
Son Jae-yeol
(School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, South Korea)
,
Son Jae-yeol
(MK Electronics, Yongin-si, Gyeonggi-do, South Korea)
,
Jung Seung-Boo
(School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, South Korea)
資料名:
Electronic Materials Letters
(Electronic Materials Letters)
巻:
16
号:
6
ページ:
513-519
発行年:
2020年
JST資料番号:
W4309A
ISSN:
1738-8090
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
ドイツ (DEU)
言語:
英語 (EN)