文献
J-GLOBAL ID:202102210643089303
整理番号:21A0277796
SnAgCuBiNiバンプによって強化されたSn_58Bi/Cuはんだ継手の微細構造と剪断挙動【JST・京大機械翻訳】
Microstructure and shear behavior of Sn58Bi/Cu solder joint enhanced by SnAgCuBiNi bump
著者 (7件):
Liu Yang
(College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou 225127, China)
,
Chang Jian
(College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou 225127, China)
,
Chang Jian
(School of Material Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China)
,
Zhou Min
(College of Physical Science and Technology, and Institute of Optoelectronic Technology, Yangzhou University, Yangzhou 225002, China)
,
Xue Yuxiong
(College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou 225127, China)
,
Zeng Xianghua
(College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou 225127, China)
,
Sun Fenglian
(School of Material Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China)
資料名:
Modern Physics Letters B. Condensed Matter Physics, Statistical Physics, Applied Physics
(Modern Physics Letters B. Condensed Matter Physics, Statistical Physics, Applied Physics)
巻:
34
号:
36
ページ:
2050413
発行年:
2020年
JST資料番号:
T0431A
ISSN:
0217-9849
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
シンガポール (SGP)
言語:
英語 (EN)