文献
J-GLOBAL ID:202102215225295779
整理番号:21A1477830
先端パッケージ応用のための低CTEポリイミド【JST・京大機械翻訳】
Low CTE Polyimide for Advanced Package Application
著者 (6件):
Zhong Ao
(The Shenzhen International Innovation Institutes of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences,Shenzhen,China,518055)
,
Li Jinhui
(The Shenzhen International Innovation Institutes of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences,Shenzhen,China,518055)
,
Shan Liang
(The Shenzhen International Innovation Institutes of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences,Shenzhen,China,518055)
,
Liu Qiang
(The Shenzhen International Innovation Institutes of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences,Shenzhen,China,518055)
,
Zhang Guoping
(The Shenzhen International Innovation Institutes of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences,Shenzhen,China,518055)
,
Sun Rong
(The Shenzhen International Innovation Institutes of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences,Shenzhen,China,518055)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2021
号:
EDTM
ページ:
1-3
発行年:
2021年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)