文献
J-GLOBAL ID:202102231901423591
整理番号:21A0011547
ミリ波アンテナインパッケージ応用のためのチップ対アンテナの低損失相互接続解【JST・京大機械翻訳】
Low loss Interconnection Solutions of Chip-to-Antenna for Millimeter-Wave Antenna-in-Package Application
著者 (4件):
Chu Chia-Ching
(Corporate Research and Development, Advanced Semiconductor Engineering (ASE), Inc., No. 26, Chin 3rd Road Nantze Export Processing Kaohsiung 811,Electrical Laboratory, Corporation Design Division,Taiwan)
,
Ho Cheng-Yu
(Corporate Research and Development, Advanced Semiconductor Engineering (ASE), Inc., No. 26, Chin 3rd Road Nantze Export Processing Kaohsiung 811,Electrical Laboratory, Corporation Design Division,Taiwan)
,
Hsieh Sheng-Chi
(Corporate Research and Development, Advanced Semiconductor Engineering (ASE), Inc., No. 26, Chin 3rd Road Nantze Export Processing Kaohsiung 811,Electrical Laboratory, Corporation Design Division,Taiwan)
,
Wang Chen-Chao
(Corporate Research and Development, Advanced Semiconductor Engineering (ASE), Inc., No. 26, Chin 3rd Road Nantze Export Processing Kaohsiung 811,Electrical Laboratory, Corporation Design Division,Taiwan)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2020
号:
IMPACT
ページ:
64-67
発行年:
2020年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)